Posting record
Open 13+ days
- Already up when Ghostless started watching Huawei Canada
- Last checked: still up
How we know
It hasn't been reposted, listed twice, or left up unusually long, and the posting doesn't say it's a talent pool.
Ghostless records the day it first sees a posting, so a repost can't reset its age. This one was already up when Ghostless started tracking Huawei Canada, so its true age is longer.
Last checked Nov 3, 2026.
How well do you match?
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Upload your resumeWhat it asks of you
- PhD asked for
What the posting discloses
- Pay
- $104k to $154k a year CAD
The total target annual compensation for this position ranges from $104,000 to $154,000 depending on education, experience, and demonstrated expertise. (quoted from the posting)
- AI screening
- No AI screening
All applications for this position are reviewed directly by our hiring team, we do not use artificial intelligence tools to screen or select candidates. (quoted from the posting)
Not stated: Real vacancy.
Why these three
Ontario requires postings from employers with 25 or more staff to state the pay, whether the vacancy exists, and whether AI screens applicants.
Skills mentioned
About the role
Huawei Canada has an immediate 12-month contract opening for an Engineer.
About the team
Welcome to the Advanced Wireless Technology Wireless Lab, an epitome of innovation located in Ottawa, Canada. Here, amid the dynamic panorama of technological progress, our team consists mainly of seasoned graduate computer engineers and computer scientists. With diverse experiences ranging from fresh perspectives to decades-long industry immersion, we are united by our fervour for pioneering wireless solutions.
About the job
- Explore 2.5D/3D integration, wafer-level packaging, diverse interposers, and embedded passives.
- Study low-loss die-to-die and die-to-package interfaces, including micro-bumps, vias, and waveguide structures.
- Develop embedded shielding, isolation structures, and localized cooling for high-power RF arrays.
- Investigate additively manufactured RF structures and engineered materials for prototyping advantages.
- Perform full-wave EM simulations to quantify interconnect loss, leakage, coupling, and noise.
- Design package transitions, antenna feeds, and grounding networks across die, substrate, and board boundaries.
- Coordinate VNA, thermal, and OTA array measurements to evaluate system-level package performance.
- Partner with internal specialists (RFIC, antenna, materials, manufacturing) to frame cross-disciplinary research.
- Secure patents and invention disclosures while publishing papers and internal technical reports.
The total target annual compensation for this position ranges from $104,000 to $154,000 depending on education, experience, and demonstrated expertise.
About the ideal candidate
- 5 years of relevant industry experiences.
- PhD in Electrical Engineering, RF/Microwave Engineering, Packaging, or a related field (or equivalent advanced R&D experience).
- Deep knowledge of RF/microwave principles.
- Experience using full-wave EM and circuit simulation tools to model packages and correlate results with measure.
- Hands-on experience designing test vehicles and directing microelectronics assembly (e.g., PCB, flip-chip, wire bonding, SMT, molding).
- Proficiency with RF lab equipment (VNAs), probe station.
- Working knowledge of thermal management, CTE mismatch, stress, warpage, and reliability testing.
Additional Information
Huawei Canada is committed to a fair, inclusive, and accessible recruitment process. If you require accommodation during any stage of the hiring process, please let us know and we will work with you to meet your needs.
All applications for this position are reviewed directly by our hiring team, we do not use artificial intelligence tools to screen or select candidates.
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