Posting record
Duplicate listingOpen 12+ days
- Lumilens' site dates the posting
- Ghostless first sees this role listed
- This listing goes up
- Last checked: still up
How we know
Duplicate listing
Identical copies of this role are live at the same time.
Ghostless records the day it first sees a posting, so a repost can't reset its age. This one was already up when Ghostless started tracking Lumilens, so its true age is longer.
Last checked Nov 4, 2026.
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Not stated: Pay, real vacancy, AI screening.
Why these three
Ontario requires postings from employers with 25 or more staff to state the pay, whether the vacancy exists, and whether AI screens applicants.
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Skills mentioned
About the role
Core Responsibilities
- Owns the process development and technical support of the Flip Chip process for silicon photonic chip wafers, with OSAT or internal line. Process may include plasma cleaning, flux engineering, pick & place, reflow, underfill, curing and/or TCB/NCP flux-less flow.
- DOE to characterize process window and margin. Optimize process integration with upstream processes (e.g. bump/FO) to increase yield and manufacturability.
- Material Characterization & Selection: Evaluate and qualify new manufacturing raw materials, including NCP, flux, underfill etc, as applicable.
- Design and execute DOE plans to characterize thermal and mechanical stress. Lead reliability validations including Temperature Cycling Test (TCT), Unbiased Highly Accelerated Stress Test (HAST) and High-Temperature Storage (HTS).
- Failure Analysis & Debug: Own the root-cause diagnostics of structural failure modes unique to FC (e.g. flux void, residue, misalignment, die warpage, reflow anomaly, underfill void etc), and formulate improvement solutions.
- Manage incoming material quality control, establish SPC control plans and monitor process variation to ensure long-term process stability.
- Compile process SOP, WI, process failure reports and engineering change documents; support NPI new product introduction and process verification.
Key Requirements & Qualifications
- Education: Bachelor or Master degree in Materials Science, Chemical Engineering, Mechanical Engineering, Microelectronics, or an equivalent technical discipline.
- Experience: 5+ years of hands-on industry experience in flip chip assembly.
Technical Knowledge
- Deep practical understanding of plasma cleaning, flux engineering, pick & place, reflow, underfill, curing and/or TCB/NCP flux-less flow.
- Comprehensive command of finite element simulation principles regarding warpage, thermal dissipation, and structural mechanical integrity.
- Solid working expertise with industry validation methodologies including FMEA, SPC controls, and structured 8D problem-solving tools.
- Software Tools: High proficiency with robust analytical platforms like JMP, Minitab.
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